Ceramic Cavity Package

Available in larger sizes up to a cavity of 16 5 mm x 6 1 mm ni780 header unmetallized frames enable shorter lead times and reduce manufacturing complexity.

Ceramic cavity package.

Air cavity type hermetic package close thermal expansion matching provides superior mechanical elasticity and less mechanical stress with silicon mems chips miniaturized high density surface mountable package incorporating multi layer ceramic technology. Ceramic air cavity packages proven performance for wireless applications. Ceramic pin grid array packages cpga cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up. The flange or heatsink material has evolved over the years and the most commonly used material today is cpc cu mo70cu cu a laminate of copper and coppermolybdenum.

The traditional package for rf power transistors is the air cavity package with a ceramic lid. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials. Cupack packages unique design with very low thermal resistance. Ca pack packages convenient pre assembled ceramic package.

Packages are available in surface mount designs as well as bolt down versions in dozens of open tooled designs.