Ceramic Dip Package

Ceramic substrates for probe cards.

Ceramic dip package.

Like dip but with staggered zig zag pins. Standard packages and lids for device evaluation. Cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up. And having a row spacing associated with body width varies depending on lead counts with 0 3 in.

Cerdip ceramic q ceramic dual inline package glass seal package drawing q filter packages by entering lead count or product description into the search box below. Medical and healthcare. The most commonly found ceramic dip packages have an inter lead spacing or lead pitch of 0 1 inch 2 54 mm. Ceramic packages for large scale integration lsi devices.

Standard dip with 0 1 in 2 54 mm pin spacing rows 0 3 in 7 62 mm apart. Package outline material information. 7 62 mm or 0 6 inch 15 24 mm. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.

Minimum pin count is 28 while the maximum pin count is limited to the manufacturer s capabilities. Spst x 4 two complementary pairs per package. Both passive or active devices may be found using ceramic packages. Material properties process flow.

Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. Eprom ics in 0 6 wide ceramic dip 40 dip 32 dip 28 dip 24 packages also known as cdip ceramic dip 8 contact dip switch with 0 3 wide 16 pin dip 16n footprint in microelectronics a dual in line package dip or dil 1 or dual in line pin package dipp 2 is an electronic component package with a rectangular housing and two. Spst x 4 two complementary pairs per package. 14 lead cerdip q 14 pdf.

Medical and healthcare.